O7252NN

QOGRISYS O7252NN Toy PCBA Solution Hardware Customization  SDK Development 

Frequency Band:2.4GHz
POWER:3.3V
Interface:USB
BT:5.0

 

Related products

 
 

 

  AI Toy PCBA Solution

  Designed with BK7252N chip, supporting multiple communication protocols ,Bluetooth, WiFi, etc.

  Integrated functions including voice interaction, power on/off, sleep mode, and network pairing;Color-coded status display for network pairing, dialogue mode, voice recognition, etc.

  Based on SDK for upper-layer AI functions, enabling direct implementation of toy intelligence.

  High-integrated space-efficient design for easy installation in various toy structures.

 

 

Application Scenario

 

Custom Toy PCBA Hardware Solutions ensure precision-engineered for optimal functionality, power efficiency, and compact form factors.Tailored Customization Services Include:

  Supports multiple communication protocols  Bluetooth 5.0/BLE, Wi-Fi, etc.

  Integrated low-power design significantly extends battery life.

  Supports voice recognition (on-device/cloud-based) and RGB LED driving, etc.

  Provides standardized dimensional specifications to accommodate product form factors.

  Supports slim-profile design for space-constrained application scenarios.

  Supports Li-ion battery management :charge/discharge protection + power monitoring.

We help customers bridge the gap from conceptual design to mass production via end-to-end custom development service , ensuring competitive advantages in performance, cost efficiency, and time-to-market.

 

 

Application Scenario

The SDK is based on hardware to fully adapt to all hardware functionalities, enabling clients to focus on holistic product development.
  SDK-enabled hardware functional control development
  Bluetooth provisioning & Wi-Fi provisioning
  Hardware-software interaction function development
We empower toy manufacturers to accelerate the transition from conventional to smart connected toys via  robust hardware-software co-development capabilities, extending product lifecycles and enhancing premium market value.

 

 

Application Scenario