Realtek Showcases High-Speed Connectivity and Intelligent Networking at Convergence India Expo 2026

Published on: 2026-03-25 08:44
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From March 23 to 25, 2026, the 33rd Convergence India Expo will be held at Pragati Maidan in New Delhi. As a leading global network and multimedia chip provider, Realtek will showcase its full-stack solutions covering communication infrastructure and smart terminals at Booth C5-275, Hall 5, highlighting its latest achievements in high-speed connectivity, intelligent computing, and network convergence.


Full-Stack Ethernet Capabilities: From Core Networks to Edge Computing

In the field of communication infrastructure, Realtek continues to strengthen its Ethernet product portfolio, building comprehensive solutions from core to edge:

  • 100GbE Optical PHY (RTL9164 series): Designed for telecom and edge AI servers, leveraging advanced CMOS processes and optimized packaging to enhance signal stability
  • 10GbE Product Line (RTL8127 / RTL8159 / RTL8261D): Based on low-power SoC architecture, supporting PCIe and USB interfaces to enable smooth upgrades to 10G networks
  • PCIe Multi-Interface Bridge (RTL9151 series): Expands Ethernet, USB, and SATA through a single PCIe channel, enabling highly integrated system designs

Overall, Realtek continues to advance in both bandwidth upgrades and high integration, addressing the growing demand for high-performance networking in data centers and edge computing.


Dual AI-Driven Evolution: Convergence of Multimedia and Edge Computing

On the smart terminal side, Realtek leverages a collaborative “edge AI + cloud AI” architecture to enhance multimedia experiences:

  • RTD1635 Dual-AI Set-Top Box Solution: Supports offline voice recognition and intelligent debugging, while optimizing audio and video processing through AI for clearer voice and smarter image recognition
  • RTD1325 4K OTT Solution: Provides a stable and smooth 4K/IPTV streaming experience
  • RTD1920S Low-Power Laptop Solution: Balances performance and battery life, meeting the needs of mobile work and learning scenarios

These solutions reflect a shift in AI from “feature enhancement” to “experience reconstruction.”


Smart Cockpit: Multi-Screen Integration with Secure Computing

In the automotive field, Realtek introduces highly integrated AI-powered smart cockpit solutions:

  • A single chip drives the instrument cluster, IVI system, and entertainment displays, enabling multi-screen collaboration
  • CPU/GPU hardware isolation architecture ensures stable operation of critical systems
  • Integrated NPU supports driver monitoring (DMS) and environmental perception (pedestrian/vehicle recognition)

With AI integration, cockpit systems are evolving from “information display” to “proactive safety + intelligent interaction.”


Wi-Fi 7 and High-Speed Connectivity: Toward Next-Generation Wireless Experience

In wireless connectivity, Realtek highlights its Wi-Fi 7 router solutions:

  • Supports dual 2.5GbE and 10G interfaces, preparing for future Wi-Fi 8 evolution
  • BE7200 solution: 4T5R architecture for stronger coverage and stability
  • BE6400 solution: Supports 4K-QAM and high-speed video transmission
  • BE3600 solution: Focuses on low power consumption and high integration, suitable for compact devices

Wi-Fi is transitioning from “speed competition” to a new stage of “stable connectivity and multi-scenario adaptability.”


Bluetooth and IoT: Building a Diverse Intelligent Ecosystem

Realtek’s Bluetooth product lineup spans from consumer electronics to industrial applications:

  • Smart dashboards and helmets: Support LE Audio and AI-based noise reduction
  • Peripheral solutions: Support 8K polling rate and seamless pairing
  • ESL (Electronic Shelf Labels): Low power consumption and secure communication
  • Smart wearables: Support Wi-Fi video transmission and efficient computing

This ecosystem further strengthens its competitiveness in the IoT sector.


PON and Switching: Enabling Carrier-Grade Network Upgrades

  • Full-mode PON solutions (GPON/XGS-PON + Wi-Fi 6/7/8): Designed for home gateways and operator networks
  • 25G PON SoC: Meets high-bandwidth requirements for enterprise and backhaul
  • Switching product line: Covers L2/L3 and cloud-managed solutions, balancing performance and flexibility

From Chips to Modules: A Critical Step for Connectivity Deployment

It is clear that from Ethernet and Wi-Fi to PON, Realtek is building a comprehensive communication technology foundation. However, in real-world product deployment, translating chip capabilities into end-device performance still relies on highly integrated and reliable communication modules.

At this stage, QOGRISYS leverages its mature end-to-end solution capabilities to introduce the O8852PM Wi-Fi 6 module, helping customers accelerate the entire process from solution validation to large-scale deployment. It is widely applicable in routers, gateways, industrial equipment, and smart terminal scenarios.


As AI, Wi-Fi 7, and 10G networks continue to evolve, the communications industry is rapidly moving toward a new era of high bandwidth, low latency, and high reliability. With chips as the foundation, modules as the bridge, and solutions as the enabler, industry collaboration will become the key driving force behind the next generation of connectivity.


Related Video: Taiwan AI Team Showcases at India’s Largest Tech Expo

#WiFi6 #WiFi7 #CommunicationModule #IoT #Ethernet #EdgeComputing #QOGRISYS #Realtek

 

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