Live from Shenzhen IOTE 2026: Deep Integration of Edge AI and Wireless Modules

From August 26th to 28th, 2026, the 25th IOTE International Internet of Things Exhibition was grandly held at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall) . With a massive exhibition area of 80,000 square meters, this year's exhibition brought together over 1,000 high-quality exhibitors from around the world, attracting 48,109 industry professionals and over 3,000 overseas visitors on the first day . The exhibition, themed "Edge Intelligence, Scenario Deepening, and Green Sustainability," was a major collaboration between AGIC 2026 Shenzhen International General Artificial Intelligence Industry Expo and GERX Global Embossed Intelligent Robot Industry Expo, achieving deep integration of IoT technology with general AI and robot intelligence .

The strongest signal released by this exhibition is that edge AI and wireless connectivity are moving from "evolving independently" to "deeply coupled". Hall 12 showcases top achievements such as AI chips, edge computing, and embodied intelligent robots , while Hall 10 focuses on industrial IoT and communication modules . The coordinated layout of the two halls itself constitutes a spatial interpretation of the "AI + connectivity" industrial logic.

I. Industry Logic: Why "Connectivity" Must Embrace "Computing"

The integration of edge AI and wireless modules is essentially a technological evolution driven by industry demands.

The centralized model, which relies solely on cloud computing power, is encountering multiple bottlenecks: industrial control scenarios require millisecond-level response times, which cloud round-trip latency cannot meet; medical and security scenarios are highly sensitive to data privacy, and uploading data to the cloud poses compliance risks; and the continuous uploading of data by massive IoT devices is driving up bandwidth and cloud computing costs. The standard architecture for AI implementation is becoming one where the terminal handles perception, the edge handles inference, and the cloud handles training and coordination—each with its own specific role.

This trend is clearly supported by data. According to a report released by IIM Information, the global wireless module market is expected to reach $48.62 billion in 2026, a 17.8% increase from $41.27 billion in 2025. Among these developments, the integration rate of AI-dedicated acceleration chips in modules continues to climb , and shipments of emerging AI edge inference modules (integrated NPU) exceeded 12 million units in the second quarter of 2026 , marking a shift in modules from simple transmission units to computing power nodes. Meanwhile, Wi-Fi 7 modules support 320MHz bandwidth and 4096-QAM modulation, and are expected to see significant adoption in routers, VR/AR devices, and other applications in 2026 .

Wireless modules are evolving from "data transmission pipelines" to "intelligent connectivity bases" with local intelligent processing capabilities. The competitive logic of next-generation wireless communication modules is undergoing profound changes: from single Wi-Fi connectivity to Wi-Fi + Bluetooth + multi-protocol collaboration; from simply transmitting data to the integration of connectivity, sensing, and edge intelligence .

II. IOTE 2026 Exhibition Confirms: Integration Has Become an Industry Consensus

At IOTE 2026, leading global wireless connectivity companies clearly outlined the industry landscape of this trend through their respective product portfolios. From chip manufacturers to module solution providers, the core positions of their booths were generally occupied by edge AI-related solutions—whether it was a wireless SoC integrating AI/ML hardware accelerators or a main control platform for embodied intelligence and generative AI terminals, the strategic focus of leading players in the industry has clearly shifted towards dual-core capabilities of "communication + computing".

Among the numerous innovative product awards presented concurrently with the exhibition, edge AI computing modules and high-performance AI chips occupied prominent positions. Several exhibitors showcased edge AI demonstration solutions supporting features such as local keyword wake-up and real-time face and gesture recognition. Meanwhile, the exhibition of supporting technologies such as high-precision wireless sensing and multi-protocol fusion further enriched the capabilities of wireless connectivity in AI scenarios.

The exhibition clearly demonstrates that competition in the wireless connectivity field has evolved from a simple contest of "communication performance" to a comprehensive competition of "communication + computing" capabilities . Simply providing high-speed, stable data transmission channels is no longer sufficient to create a differentiated advantage. The ability to provide computing power support and intelligent collaboration for edge AI applications on top of connectivity capabilities is becoming a new benchmark for measuring the technological strength of module manufacturers.

III. Application Scenarios: Where to Deploy Edge AI + Wireless Modules

The integration of edge AI and wireless modules is being rapidly implemented in multiple vertical scenarios.

Industrial manufacturing is one of the most mature scenarios for the integration of edge AI and wireless modules. Hall 10 of the exhibition focuses specifically on industrial IoT and embedded solutions, connecting three major technology tracks: intelligent sensing, IoT communication, and precise positioning . In intelligent manufacturing scenarios, AGV/AMR autonomous transport vehicles, industrial sensors, and monitoring systems have rigid requirements for low-latency wireless connectivity and local AI inference capabilities. Wireless modules need to provide stable connectivity in high-interference industrial environments, while providing a communication foundation for AI applications such as visual inspection and predictive maintenance on the equipment side.

Smart homes and smart buildings are another important scenario. In the smart home scenario, local AI processing means that voice commands can be responded to without being uploaded to the cloud, which reduces latency and protects user privacy—this is the core value of edge AI.

Smart retail and smart cities also benefit from this trend. The exhibition comprehensively covered more than 20 core application scenarios, including smart logistics and smart consumption . In the smart retail scenario, AI POS terminals, smart vending machines, and other devices need to complete inference tasks such as image recognition and behavior analysis locally, while relying on wireless modules to achieve data synchronization and remote management with the cloud.

Drones and robots represent emerging high-growth sectors. Drone solutions integrate Wi-Fi modules, 5G communication, and edge AI computing capabilities, supporting applications such as long-distance image transmission, remote control, real-time image recognition, and intelligent monitoring. With the rapid development of embodied intelligent robots, the demand for high-bandwidth, low-latency wireless connectivity and local AI inference capabilities will continue to surge.

IV. Qogrisys's Solution Layout: A "Smart Connection Dock" with Wi-Fi 7 + Bluetooth 6.0

In light of this industry trend, the layout of QOGRISYS Technology Co., Ltd., headquartered in Shenzhen, is highly representative.

Founded in 2014, Qogrisys Technology focuses on the communication connectivity industry, committed to providing customers with comprehensive IoT connectivity solutions. The company partners upstream with chip manufacturers such as Qualcomm, Realtek, Woogi, and HiSilicon, and downstream with end customers in smart home, industrial IoT, and automotive electronics sectors. Its main products cover 2.4G/5.8G Wi-Fi modules, BLE modules, PLC modules , RF antenna components, and smart hardware solutions.

Core Product: O2072PM Wi-Fi 7 + Bluetooth 6.0 Combination Module

Qogrisys has launched two Wi-Fi 7 + Bluetooth 6.0 combo modules, the O2072PM and O2072PB , based on the Qualcomm FastConnect C7700 (chip code QCC2072) chip . The QCC2072 is designed to provide ultra-high-speed connectivity, with peak speeds up to 5.8Gbps, and features a 320MHz channel, 4K QAM, and Multi-Link Operation (MLO) capabilities .

The O2072PM uses an M.2 Key E standard interface (22×30mm) , fully supporting 4K QAM, 320MHz channels, and MLO (Multi-Link Operation), with a peak rate of 5.8Gbps . The Wi-Fi portion complies with IEEE 802.11a/b/g/n/ ac /ax/be standards, supporting tri-band 2.4 GHz/5 GHz/6 GHz, with each band supporting up to 4096 QAM modulation . The Bluetooth portion is compatible with Bluetooth 6.0, supporting dual-mode Bluetooth, Tx beamforming, MRC, LE Audio, and 2 Mbps Bluetooth Low Energy (BLE) .

Of particular note is that the O2072PM also supports high-precision distance measurement (HADM/channel detection) , providing new technological possibilities for scenarios such as indoor positioning and asset tracking.

The O2072PM is clearly designed to meet the "connectivity foundation" requirement in edge AI scenarios—providing stable, high-bandwidth, and low-latency wireless connectivity for high-performance edge platforms. With the continuous improvement of edge AI computing power, the low latency and high reliability of Wi-Fi 7 are becoming the core communication foundation for edge computing. The higher speed and lower latency offered by Wi-Fi 7 enable the module to achieve a better product experience across a wider range of devices .

Domestic platform adaptation capabilities

Qogrisys's foray into the Wi-Fi 6 field is also noteworthy. Its O9201 SB/ O9 1 01 SA/ O9201PM series modules have completed driver adaptation and verification on domestic platforms such as RK3588, Allwinner, and Rockchip, and can be widely used in industrial tablets, edge computing gateways, industrial control equipment, and other scenarios. This demonstrates Qogrisys's deep technical accumulation in adapting to domestic platforms and wireless connectivity.

In terms of product portfolio, Qogrisys is building a complete wireless connectivity solution covering Wi-Fi 4/5/6/7 and BLE, following the path of "using a full hardware platform as the foundation and vertical scenarios as the direction" .

V. Outlook: The Era of "Intelligent Connectivity" in the Module Industry

Looking ahead to 2026-2030, the industry will enter the era of "intelligent connectivity." Edge AI modules have become a new growth engine for the wireless module industry. According to an IIM report, the global wireless module market is projected to exceed $90 billion by 2030, with edge AI and satellite direct connection modules expected to grow at a compound annual growth rate of over 30%.

The deep integration of edge AI and wireless modules is not an optional "icing on the cake," but an inevitable path for industry development . For wireless module manufacturers, their ability to synergize with edge AI platforms beyond mere connectivity, and to provide a highly reliable communication foundation for edge AI applications, will determine their position in the next stage of competition.

The IOTE 2026 exhibition showcases a true picture of this ongoing transformation—from "connecting everything" to "intelligently connecting everything." Qogrisys Technology, with Shenzhen as its origin, Wi-Fi 7 + Bluetooth 6.0 as its connectivity platform, and full-scenario coverage as its goal, is contributing its strength to this transformation.